中文
400-888-0829
SAM-US301
Application
IGBT/ SiC module layered detection
Semiconductor chip packaging layered detection
Diamond thickness measurement and inter issue detection
Heat sink detection
Features
Non-destructive testing with high efficiency
High scan speed and high resolution imaging
Multi-layer defect up to 1000 layers
Real-time display and analysis software for detection images
Customizable waterproof fixtures fordifferent products
Multiple channels （2 or 4 channels）are available
Technical Parameter
Foot print
1100mm×1020mm×1550mm
Dimension of water tank
645mm×750mm×155mm
Scanning range
400mm×320mm×120mm
Maximum scanning speed
2000㎜/s
Resolution
1~4000μm
Emission and reception bandwidth
1~500MHz
Water-wastewater system
Water pressure inlet, gravity drainage
Sealing Fixtures
Customizable
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